| PARAMETERS |
VALUES ($) |
Breakdown [%/$] |
| WAFER + EPILAYER COST ($) |
|
|
|
| PROCESS COST ($) |
|
| |
| PROBING COST ($) |
|
|
|
| SAWING COST ($) |
|
|
|
| PACKAGING LOT FEE ($) |
|
|
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| UNIT PACKAGING COST ($) |
|
|
|
| TEST COST ($) |
|
|
|
|
| Die Width [w] (mm) |
| ⌉ |
🔗 |
|
| Die Height [h] (mm) |
| ⌋ |
| Horizontal Scribe Lane [sh] (mm) |
| ⌉ |
🔗 |
|
| Vertical Scribe Lane [sv] (mm) |
| ⌋ |
| Edge Loss (mm) |
|
| Defect Density (#/sq.cm) |
|
| Manual wafer placement [horizontal shift] |
|
| Manual wafer placement [vertical shift] |
|
| Wafer Diameter (mm) |
|
| Die Centering / Wafer Centering (check/uncheck) |
|